JPH0151071B2 - - Google Patents
Info
- Publication number
- JPH0151071B2 JPH0151071B2 JP19246281A JP19246281A JPH0151071B2 JP H0151071 B2 JPH0151071 B2 JP H0151071B2 JP 19246281 A JP19246281 A JP 19246281A JP 19246281 A JP19246281 A JP 19246281A JP H0151071 B2 JPH0151071 B2 JP H0151071B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- pellet
- receiving surface
- mold
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56192462A JPS5893388A (ja) | 1981-11-30 | 1981-11-30 | 反射型光結合半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56192462A JPS5893388A (ja) | 1981-11-30 | 1981-11-30 | 反射型光結合半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5893388A JPS5893388A (ja) | 1983-06-03 |
JPH0151071B2 true JPH0151071B2 (en]) | 1989-11-01 |
Family
ID=16291694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56192462A Granted JPS5893388A (ja) | 1981-11-30 | 1981-11-30 | 反射型光結合半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5893388A (en]) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59168682A (ja) * | 1983-03-15 | 1984-09-22 | Sharp Corp | 反射型ホトセンサ |
JPH0620159B2 (ja) * | 1984-02-16 | 1994-03-16 | 株式会社東芝 | 光半導体装置の製造方法 |
JPS6461071A (en) * | 1987-08-31 | 1989-03-08 | Sharp Kk | Optical semiconductor device |
TW418422B (en) | 1998-05-20 | 2001-01-11 | Rohm Co Ltd | Reflection-type sensor |
DE102008025159A1 (de) | 2008-05-26 | 2009-12-10 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement, Reflexlichtschranke und Verfahren zur Herstellung eines Gehäuses |
DE102010053809A1 (de) | 2010-12-08 | 2012-06-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement, Verfahren zu dessen Herstellung und Verwendung eines derartigen Bauelements |
-
1981
- 1981-11-30 JP JP56192462A patent/JPS5893388A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5893388A (ja) | 1983-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100428482C (zh) | 固体摄像装置及其制造方法 | |
US7368329B2 (en) | Diode housing | |
US6353257B1 (en) | Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention | |
JPS60126850A (ja) | 集積回路パツケ−ジ | |
KR980006214A (ko) | 카드형 기억장치 | |
JP3838572B2 (ja) | 固体撮像装置およびその製造方法 | |
CN101005109A (zh) | 小尺寸led器件用引线框架及其制造方法 | |
KR100428271B1 (ko) | 집적회로패키지와그제조방법 | |
JP2936669B2 (ja) | 樹脂封止型半導体装置 | |
US4877756A (en) | Method of packaging a semiconductor laser and photosensitive semiconductor device | |
JPH1070217A (ja) | 樹脂封止型半導体装置及びその金型構造 | |
US20200227343A1 (en) | Semiconductor device package | |
JPH0151071B2 (en]) | ||
JP2006332685A (ja) | 固体撮像装置 | |
JPS6260829B2 (en]) | ||
JPH0620159B2 (ja) | 光半導体装置の製造方法 | |
JP4390989B2 (ja) | 電子部品およびその製造方法 | |
JPS6323674B2 (en]) | ||
JPH11340480A (ja) | プラスティックパッケージ | |
CN222692248U (zh) | 一种微型led封装结构及显示装置 | |
JPS59119774A (ja) | 光結合半導体装置 | |
JPH09232623A (ja) | フォトカプラ及びその製造方法 | |
JPS62247575A (ja) | 光結合素子の製造方法 | |
JP3165632B2 (ja) | 発光素子及びその製造方法 | |
JPH03255677A (ja) | 反射板付き発光表示装置の製造方法 |